1.Material:Aluminum Nitride.
2.Function:Insulation and heat dissipation ceramic.
3.Type:Ceramic.
4.Color:Gray.
5.Can be customed:yes,please provide drawings for specific products.
Ceramic Aluminum Nitride Direct Wafer Bonding
Product Description:
There is a method was developed for the direct wafer-to-wafer bonding of aluminum nitride(AlN) to AlN-coated wafers.Direct wafer bonding requires smooth, flat, hydrophilic surfaces that are able to be activated with appropriately charged hydrogen molecules on the prepared surfaces.Huaqing can provide AlN substrate with very smooth(Ra≤0.03um) and flat surface.
Our Aluminum Nitride substrates (AlN) are available in various sizes and thicknesses. Thanks to a large and live inventory, we can ship your part fast for you to start your project.
Our Service:
Please contact us for customization. We can also supply Aluminum Nitride (AlN) Ceramic with thermal conductivity up to 230W/mK
Specification:
Dimension (LxW) | φ50.8mm,φ101.6mm etc. |
Thickness | 0.38-2.0 mm |
Thermal Conductivity | 170-230W/m.K |
Dielectric Constant | 8-9 (MHz) |
Bulk Density | 3.3 g/cm³ |
Surface Roughness | Ra ≤0.03 μm on both sides |
Company Advantage:
Huaqing Founded in 2004, with sum investment of 80Million RMB, registered capital 40Million RMB. Huaqing's AlN & Al2O3 ceramic products have high thermal-conductivity, low dielectric constant, good dissipation factor and excellent mechanical property compared with the other factories in the industry. AlN & Al2O3 ceramic are widely used in HBLED, opto-communication, IGBT, power devices, TEC and the other high-end applications.
Workshop & Equipment:
Packaging & Delivery:
Deliver by UPS,DHL,Fedex etc
Why you need our services, you know you're getting highly qualified professionals who have the expertise and experience to make sure your project is done properly and functions.
if you would like a free consultation, please start bg completing the form: