The TO-220 package is a "power package" intended for power semiconductors and an example of a through-hole design rather than a surface-mount technology type of package. TO-220 packages can be mounted to a heat sink(Aluminum nitride ceramic) to dissipate several watts of waste heat. On a so-called "infinite heat sink", this can be 50 W or more.
1.Material:Aluminum Nitride.
2.Function:Insulation and heat dissipation ceramic.
3.Type:Ceramic.
4.Color:Gray.
5.Can be customed:yes,please provide drawings for specific products.
AlN Ceramic substrate TO220 package
Product Description:
The TO-220 is commonly used for housing transistors, thyristors, and integrated circuits with low lead counts.
Our Aluminum Nitride substrates (AlN) are available in various sizes and thicknesses. Thanks to a large and live inventory, we can ship your part fast for you to start your project.
Our Service：
Please contact us for customization. We can also supply Aluminum Nitride (AlN) Ceramic with thermal conductivity up to 230W/mK
Specification:
| Dimension (LxW) | 18*13mm,18*12mm etc. |
| Thickness | 0.635/1.0 mm |
| Thermal Conductivity | 170W/m.K |
| Dielectric Constant | 8-9 (MHz) |
| Bulk Density | 3.3 g/cm³ |
| Surface Roughness | Ra < 0.6 μm on both sides |
Company Advantage:
Huaqing Founded in 2004, with sum investment of 80Million RMB, registered capital 40Million RMB. Huaqing's AlN & Al2O3 ceramic products have high thermal-conductivity, low dielectric constant, good dissipation factor and excellent mechanical property compared with the other factories in the industry. AlN & Al2O3 ceramic are widely used in HBLED, opto-communication, IGBT, power devices, TEC and the other high-end applications.
Workshop & Equipment:
Packaging & Delivery:
Deliver by UPS,DHL,Fedex etc
The TO-220 package is a "power package" intended for power semiconductors and an example of a through-hole design rather than a surface-mount technology type of package. TO-220 packages can be mounted to a heat sink(Aluminum nitride ceramic) to dissipate several watts of waste heat. On a so-called "infinite heat sink", this can be 50 W or more. 1.Material:Aluminum Nitride. 2.Function:Insulation and heat dissipation ceramic. 3.Type:Ceramic. 4.Color:Gray. 5.Can be customed:yes,please provide drawings for specific products.
Learn More
The TO-220 package is a "power package" intended for power semiconductors and an example of a through-hole design rather than a surface-mount technology type of package. TO-220 packages can be mounted to a heat sink(Aluminum nitride ceramic) to dissipate several watts of waste heat. On a so-called "infinite heat sink", this can be 50 W or more. 1.Material:Aluminum Nitride. 2.Function:Insulation and heat dissipation ceramic. 3.Type:Ceramic. 4.Color:Gray. 5.Can be customed:yes,please provide drawings for specific products.
Learn More
The TO-220 package is a "power package" intended for power semiconductors and an example of a through-hole design rather than a surface-mount technology type of package. TO-220 packages can be mounted to a heat sink(Aluminum nitride ceramic) to dissipate several watts of waste heat. On a so-called "infinite heat sink", this can be 50 W or more. 1.Material:Aluminum Nitride. 2.Function:Insulation and heat dissipation ceramic. 3.Type:Ceramic. 4.Color:Gray. 5.Can be customed:yes,please provide drawings for specific products.
Learn More
The TO-220 package is a "power package" intended for power semiconductors and an example of a through-hole design rather than a surface-mount technology type of package. TO-220 packages can be mounted to a heat sink(Aluminum nitride ceramic) to dissipate several watts of waste heat. On a so-called "infinite heat sink", this can be 50 W or more. 1.Material:Aluminum Nitride. 2.Function:Insulation and heat dissipation ceramic. 3.Type:Ceramic. 4.Color:Gray. 5.Can be customed:yes,please provide drawings for specific products.
Learn More
The TO-220 package is a "power package" intended for power semiconductors and an example of a through-hole design rather than a surface-mount technology type of package. TO-220 packages can be mounted to a heat sink(Aluminum nitride ceramic) to dissipate several watts of waste heat. On a so-called "infinite heat sink", this can be 50 W or more. 1.Material:Aluminum Nitride. 2.Function:Insulation and heat dissipation ceramic. 3.Type:Ceramic. 4.Color:Gray. 5.Can be customed:yes,please provide drawings for specific products.
Learn More
The TO-220 package is a "power package" intended for power semiconductors and an example of a through-hole design rather than a surface-mount technology type of package. TO-220 packages can be mounted to a heat sink(Aluminum nitride ceramic) to dissipate several watts of waste heat. On a so-called "infinite heat sink", this can be 50 W or more. 1.Material:Aluminum Nitride. 2.Function:Insulation and heat dissipation ceramic. 3.Type:Ceramic. 4.Color:Gray. 5.Can be customed:yes,please provide drawings for specific products.
Learn More
The TO-220 package is a "power package" intended for power semiconductors and an example of a through-hole design rather than a surface-mount technology type of package. TO-220 packages can be mounted to a heat sink(Aluminum nitride ceramic) to dissipate several watts of waste heat. On a so-called "infinite heat sink", this can be 50 W or more. 1.Material:Aluminum Nitride. 2.Function:Insulation and heat dissipation ceramic. 3.Type:Ceramic. 4.Color:Gray. 5.Can be customed:yes,please provide drawings for specific products.
Learn More
The TO-220 package is a "power package" intended for power semiconductors and an example of a through-hole design rather than a surface-mount technology type of package. TO-220 packages can be mounted to a heat sink(Aluminum nitride ceramic) to dissipate several watts of waste heat. On a so-called "infinite heat sink", this can be 50 W or more. 1.Material:Aluminum Nitride. 2.Function:Insulation and heat dissipation ceramic. 3.Type:Ceramic. 4.Color:Gray. 5.Can be customed:yes,please provide drawings for specific products.
Learn More
The TO-220 package is a "power package" intended for power semiconductors and an example of a through-hole design rather than a surface-mount technology type of package. TO-220 packages can be mounted to a heat sink(Aluminum nitride ceramic) to dissipate several watts of waste heat. On a so-called "infinite heat sink", this can be 50 W or more. 1.Material:Aluminum Nitride. 2.Function:Insulation and heat dissipation ceramic. 3.Type:Ceramic. 4.Color:Gray. 5.Can be customed:yes,please provide drawings for specific products.
Learn More
The TO-220 package is a "power package" intended for power semiconductors and an example of a through-hole design rather than a surface-mount technology type of package. TO-220 packages can be mounted to a heat sink(Aluminum nitride ceramic) to dissipate several watts of waste heat. On a so-called "infinite heat sink", this can be 50 W or more. 1.Material:Aluminum Nitride. 2.Function:Insulation and heat dissipation ceramic. 3.Type:Ceramic. 4.Color:Gray. 5.Can be customed:yes,please provide drawings for specific products.
Learn More
The TO-220 package is a "power package" intended for power semiconductors and an example of a through-hole design rather than a surface-mount technology type of package. TO-220 packages can be mounted to a heat sink(Aluminum nitride ceramic) to dissipate several watts of waste heat. On a so-called "infinite heat sink", this can be 50 W or more. 1.Material:Aluminum Nitride. 2.Function:Insulation and heat dissipation ceramic. 3.Type:Ceramic. 4.Color:Gray. 5.Can be customed:yes,please provide drawings for specific products.
Learn More
The TO-220 package is a "power package" intended for power semiconductors and an example of a through-hole design rather than a surface-mount technology type of package. TO-220 packages can be mounted to a heat sink(Aluminum nitride ceramic) to dissipate several watts of waste heat. On a so-called "infinite heat sink", this can be 50 W or more. 1.Material:Aluminum Nitride. 2.Function:Insulation and heat dissipation ceramic. 3.Type:Ceramic. 4.Color:Gray. 5.Can be customed:yes,please provide drawings for specific products.
Learn More
The TO-220 package is a "power package" intended for power semiconductors and an example of a through-hole design rather than a surface-mount technology type of package. TO-220 packages can be mounted to a heat sink(Aluminum nitride ceramic) to dissipate several watts of waste heat. On a so-called "infinite heat sink", this can be 50 W or more. 1.Material:Aluminum Nitride. 2.Function:Insulation and heat dissipation ceramic. 3.Type:Ceramic. 4.Color:Gray. 5.Can be customed:yes,please provide drawings for specific products.
Learn More
The TO-220 package is a "power package" intended for power semiconductors and an example of a through-hole design rather than a surface-mount technology type of package. TO-220 packages can be mounted to a heat sink(Aluminum nitride ceramic) to dissipate several watts of waste heat. On a so-called "infinite heat sink", this can be 50 W or more. 1.Material:Aluminum Nitride. 2.Function:Insulation and heat dissipation ceramic. 3.Type:Ceramic. 4.Color:Gray. 5.Can be customed:yes,please provide drawings for specific products.
Learn More
The TO-220 package is a "power package" intended for power semiconductors and an example of a through-hole design rather than a surface-mount technology type of package. TO-220 packages can be mounted to a heat sink(Aluminum nitride ceramic) to dissipate several watts of waste heat. On a so-called "infinite heat sink", this can be 50 W or more. 1.Material:Aluminum Nitride. 2.Function:Insulation and heat dissipation ceramic. 3.Type:Ceramic. 4.Color:Gray. 5.Can be customed:yes,please provide drawings for specific products.
Learn More
The TO-220 package is a "power package" intended for power semiconductors and an example of a through-hole design rather than a surface-mount technology type of package. TO-220 packages can be mounted to a heat sink(Aluminum nitride ceramic) to dissipate several watts of waste heat. On a so-called "infinite heat sink", this can be 50 W or more. 1.Material:Aluminum Nitride. 2.Function:Insulation and heat dissipation ceramic. 3.Type:Ceramic. 4.Color:Gray. 5.Can be customed:yes,please provide drawings for specific products.
Learn More
The TO-220 package is a "power package" intended for power semiconductors and an example of a through-hole design rather than a surface-mount technology type of package. TO-220 packages can be mounted to a heat sink(Aluminum nitride ceramic) to dissipate several watts of waste heat. On a so-called "infinite heat sink", this can be 50 W or more. 1.Material:Aluminum Nitride. 2.Function:Insulation and heat dissipation ceramic. 3.Type:Ceramic. 4.Color:Gray. 5.Can be customed:yes,please provide drawings for specific products.
Learn More
The TO-220 package is a "power package" intended for power semiconductors and an example of a through-hole design rather than a surface-mount technology type of package. TO-220 packages can be mounted to a heat sink(Aluminum nitride ceramic) to dissipate several watts of waste heat. On a so-called "infinite heat sink", this can be 50 W or more. 1.Material:Aluminum Nitride. 2.Function:Insulation and heat dissipation ceramic. 3.Type:Ceramic. 4.Color:Gray. 5.Can be customed:yes,please provide drawings for specific products.
Learn More
The TO-220 package is a "power package" intended for power semiconductors and an example of a through-hole design rather than a surface-mount technology type of package. TO-220 packages can be mounted to a heat sink(Aluminum nitride ceramic) to dissipate several watts of waste heat. On a so-called "infinite heat sink", this can be 50 W or more. 1.Material:Aluminum Nitride. 2.Function:Insulation and heat dissipation ceramic. 3.Type:Ceramic. 4.Color:Gray. 5.Can be customed:yes,please provide drawings for specific products.
Learn More
The TO-220 package is a "power package" intended for power semiconductors and an example of a through-hole design rather than a surface-mount technology type of package. TO-220 packages can be mounted to a heat sink(Aluminum nitride ceramic) to dissipate several watts of waste heat. On a so-called "infinite heat sink", this can be 50 W or more. 1.Material:Aluminum Nitride. 2.Function:Insulation and heat dissipation ceramic. 3.Type:Ceramic. 4.Color:Gray. 5.Can be customed:yes,please provide drawings for specific products.
Learn More
The TO-220 package is a "power package" intended for power semiconductors and an example of a through-hole design rather than a surface-mount technology type of package. TO-220 packages can be mounted to a heat sink(Aluminum nitride ceramic) to dissipate several watts of waste heat. On a so-called "infinite heat sink", this can be 50 W or more. 1.Material:Aluminum Nitride. 2.Function:Insulation and heat dissipation ceramic. 3.Type:Ceramic. 4.Color:Gray. 5.Can be customed:yes,please provide drawings for specific products.
Learn More
The TO-220 package is a "power package" intended for power semiconductors and an example of a through-hole design rather than a surface-mount technology type of package. TO-220 packages can be mounted to a heat sink(Aluminum nitride ceramic) to dissipate several watts of waste heat. On a so-called "infinite heat sink", this can be 50 W or more. 1.Material:Aluminum Nitride. 2.Function:Insulation and heat dissipation ceramic. 3.Type:Ceramic. 4.Color:Gray. 5.Can be customed:yes,please provide drawings for specific products.
Learn More
The TO-220 package is a "power package" intended for power semiconductors and an example of a through-hole design rather than a surface-mount technology type of package. TO-220 packages can be mounted to a heat sink(Aluminum nitride ceramic) to dissipate several watts of waste heat. On a so-called "infinite heat sink", this can be 50 W or more. 1.Material:Aluminum Nitride. 2.Function:Insulation and heat dissipation ceramic. 3.Type:Ceramic. 4.Color:Gray. 5.Can be customed:yes,please provide drawings for specific products.
Learn More
The TO-220 package is a "power package" intended for power semiconductors and an example of a through-hole design rather than a surface-mount technology type of package. TO-220 packages can be mounted to a heat sink(Aluminum nitride ceramic) to dissipate several watts of waste heat. On a so-called "infinite heat sink", this can be 50 W or more. 1.Material:Aluminum Nitride. 2.Function:Insulation and heat dissipation ceramic. 3.Type:Ceramic. 4.Color:Gray. 5.Can be customed:yes,please provide drawings for specific products.
Learn More
The TO-220 package is a "power package" intended for power semiconductors and an example of a through-hole design rather than a surface-mount technology type of package. TO-220 packages can be mounted to a heat sink(Aluminum nitride ceramic) to dissipate several watts of waste heat. On a so-called "infinite heat sink", this can be 50 W or more. 1.Material:Aluminum Nitride. 2.Function:Insulation and heat dissipation ceramic. 3.Type:Ceramic. 4.Color:Gray. 5.Can be customed:yes,please provide drawings for specific products.
Learn More
The TO-220 package is a "power package" intended for power semiconductors and an example of a through-hole design rather than a surface-mount technology type of package. TO-220 packages can be mounted to a heat sink(Aluminum nitride ceramic) to dissipate several watts of waste heat. On a so-called "infinite heat sink", this can be 50 W or more. 1.Material:Aluminum Nitride. 2.Function:Insulation and heat dissipation ceramic. 3.Type:Ceramic. 4.Color:Gray. 5.Can be customed:yes,please provide drawings for specific products.
Learn More
The TO-220 package is a "power package" intended for power semiconductors and an example of a through-hole design rather than a surface-mount technology type of package. TO-220 packages can be mounted to a heat sink(Aluminum nitride ceramic) to dissipate several watts of waste heat. On a so-called "infinite heat sink", this can be 50 W or more. 1.Material:Aluminum Nitride. 2.Function:Insulation and heat dissipation ceramic. 3.Type:Ceramic. 4.Color:Gray. 5.Can be customed:yes,please provide drawings for specific products.
Learn More
The TO-220 package is a "power package" intended for power semiconductors and an example of a through-hole design rather than a surface-mount technology type of package. TO-220 packages can be mounted to a heat sink(Aluminum nitride ceramic) to dissipate several watts of waste heat. On a so-called "infinite heat sink", this can be 50 W or more. 1.Material:Aluminum Nitride. 2.Function:Insulation and heat dissipation ceramic. 3.Type:Ceramic. 4.Color:Gray. 5.Can be customed:yes,please provide drawings for specific products.
Learn More
The TO-220 package is a "power package" intended for power semiconductors and an example of a through-hole design rather than a surface-mount technology type of package. TO-220 packages can be mounted to a heat sink(Aluminum nitride ceramic) to dissipate several watts of waste heat. On a so-called "infinite heat sink", this can be 50 W or more. 1.Material:Aluminum Nitride. 2.Function:Insulation and heat dissipation ceramic. 3.Type:Ceramic. 4.Color:Gray. 5.Can be customed:yes,please provide drawings for specific products.
Learn More
The TO-220 package is a "power package" intended for power semiconductors and an example of a through-hole design rather than a surface-mount technology type of package. TO-220 packages can be mounted to a heat sink(Aluminum nitride ceramic) to dissipate several watts of waste heat. On a so-called "infinite heat sink", this can be 50 W or more. 1.Material:Aluminum Nitride. 2.Function:Insulation and heat dissipation ceramic. 3.Type:Ceramic. 4.Color:Gray. 5.Can be customed:yes,please provide drawings for specific products.
Learn More
The TO-220 package is a "power package" intended for power semiconductors and an example of a through-hole design rather than a surface-mount technology type of package. TO-220 packages can be mounted to a heat sink(Aluminum nitride ceramic) to dissipate several watts of waste heat. On a so-called "infinite heat sink", this can be 50 W or more. 1.Material:Aluminum Nitride. 2.Function:Insulation and heat dissipation ceramic. 3.Type:Ceramic. 4.Color:Gray. 5.Can be customed:yes,please provide drawings for specific products.
Learn More
The TO-220 package is a "power package" intended for power semiconductors and an example of a through-hole design rather than a surface-mount technology type of package. TO-220 packages can be mounted to a heat sink(Aluminum nitride ceramic) to dissipate several watts of waste heat. On a so-called "infinite heat sink", this can be 50 W or more. 1.Material:Aluminum Nitride. 2.Function:Insulation and heat dissipation ceramic. 3.Type:Ceramic. 4.Color:Gray. 5.Can be customed:yes,please provide drawings for specific products.
Learn More
The TO-220 package is a "power package" intended for power semiconductors and an example of a through-hole design rather than a surface-mount technology type of package. TO-220 packages can be mounted to a heat sink(Aluminum nitride ceramic) to dissipate several watts of waste heat. On a so-called "infinite heat sink", this can be 50 W or more. 1.Material:Aluminum Nitride. 2.Function:Insulation and heat dissipation ceramic. 3.Type:Ceramic. 4.Color:Gray. 5.Can be customed:yes,please provide drawings for specific products.
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