DBC (Direct Bonding Copper) is the direct mating of two dissimilar electronic materials (Copper and Ceramic). The interface between the pure copper and the ceramic is very reliable.
1.Material:Alumina/ZTA/Si3N4.
2.Function:Insulation and heat dissipation ceramics.
3.Type:Metallized ceramic.
4.Can be customed:yes,please provide drawings for specific products.
DBC ceramic Substrate for power electronic
Product Description:
One of the main advantages of the DBC vs other power electronic substrates is their low coefficient of thermal expansion, which is close to that of silicon (compared to pure copper). This ensures good thermal cycling performances (up to 50,000 cycles).
Our Service:
Please contact us for customization. We can also supply Aluminum Nitride (AlN) Ceramic with thermal conductivity up to 230W/mK
Specification:
Copper/Ceramic/Copper specification(mm) | ||||||
Al2O3-DBC | 0.20/0.38/0.20 | 0.25/0.38/0.25 | 0.3/0.38/0.30 | 0.20/0.64/0.20 | 0.25/0.64/0.25 | 0.30/0.64/0.30 |
ZTA-DBC | 0.20/0.32/0.20 | 0.25/0.32/0.25 | 0.30/0.32/0.30 |
Company Advantage:
Huaqing Founded in 2004, with sum investment of 80Million RMB, registered capital 40Million RMB. Huaqing's AlN & Al2O3 ceramic products have high thermal-conductivity, low dielectric constant, good dissipation factor and excellent mechanical property compared with the other factories in the industry. AlN & Al2O3 ceramic are widely used in HBLED, opto-communication, IGBT, power devices, TEC and the other high-end applications.
Workshop & Equipment:
Packaging & Delivery:
Deliver by UPS,DHL,Fedex etc
Why you need our services, you know you're getting highly qualified professionals who have the expertise and experience to make sure your project is done properly and functions.
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