AMB(Active Metal Brazing Substrate) is the further development of DBC technology. It is a method to use a small amount of active elements such as Ti and Zr contained in the filler metal to react with ceramics to form a reaction layer that can be wetted by liquid solder, so as to realize the bonding between ceramics and metals. AMB is combined by chemical reaction between ceramic and active metal solder at high temperature, so its bonding strength is higher and its reliability is better. 1.Material:Aluminum Nitride/Alumina/ZTA/Si3N4. 2.Function:Insulation and heat dissipation ceramics. 3.Type:Metallized ceramic. 4.Can be customed:yes,please provide drawings for specific products.